Technical Specifications

General

Basic materials	FR4/FR4 HTg/FR2/CEM1/ CEM3/BT-EPOXI/Alta Frecuencia
Electrical continuity	Max 10 Ohms
Aspect Ratio	1:14
Ionic contamination	Max 1micrEquivgr NaCl/cm2
Impedance control	Si
Flammability	94V-0 (MOT 105º,130º)
Finishes	Rohs, non-Rohs
Gold connections	Si
Graphite contact points	Si
Strippable/Kapton tape	Si
Component markings:	Si
Polymerised drilling	Si

SUPERFICIAL GEOMETRY (X and Y axes)
Max. dimensions	600×600 mm
Width/Space of/between Conductors	0.10 mm
Min. diameter
Metallised drill hole	0.2 mm
Non-metallised drill hole	0.3 mm
Buried drill hole	0.2 mm
Microvia	0.1 mm
Register precision
Drill hole/external pads	max 0.1 mm
Drill hole/internal pads	max 0.15 mm
Drill hole/outline	max 0.1 mm
Pad/soldermask	max 0.1 mm
Between layers	max 0.1 mm
Tolerance of diameter of drill holes
Metallised	-0.0/+0.1 mm
Non-metallised	-0.0/+0.05 mm
Tolerance of the external profile	± 0.1 mm
Unmetallised space for grooves	min 0.8 mm
Position error for grooves	± 0.10 mm
Width of photosensitive ink	min 0.12 mm
Distance between copper pad/ photosensitive ink	min 0.12 mm
Legend width	min 0.12 mm
Graphite width	min 0.5 mm
Space between graphites	min 0.4 mm
Graphite/copper spacing	min 0.4 mm
Strippable margin	min 0.4 mm
Strippable/node space	min 1.0 mm
Max diameter covered strippable drill hole	1.8 mm

MICROSECTION (Z axis)