PCB Manufacture

We are specialists in custom PCB manufacturing, both in short series and large productions, with high quality materials and rigorous control

Printed circuits for all sectors

High-quality PCB manufacturing: technology, precision, and experience since 1965

At CISA, Circuitos Impresos, S.A., we have been specialists in PCB manufacturing since 1965, positioning us as one of the most experienced and established printed circuit board manufacturers in Spain. We design and produce highly complex printed circuit boards, adapting to the technical needs of each client and project.

We offer solutions in rigid PCBs (from 2 to 20 layers), flexible (up to 10 layers) and Rigid-Flex (up to 14 layers), using certified materials and advanced production processes that guarantee reliability, durability and precision.

Experts in rigid, flex, and rigid-flex printed circuit boards since 1965

Custom PCB manufacturing

We work for demanding sectors such as telecommunications, medicine, automotive, LED lighting, defense, electronics, and consumer goods, always meeting high standards of quality, traceability, and delivery.

Our highly qualified technical team and the use of cutting-edge technology allow us to offer a comprehensive service in the manufacturing of printed circuit boards, from prototype to mass production.

CISA represents trust, innovation and commitment in every PCB we manufacture. We offer the following types of circuits:

  • Flexible.
  • Rigid
  • Rigid-Flex.
  • Monoface
  • Doubleface
  • Multilayer
  • Aluminium
  • Heavy Copper.
  • Ceramic
  • HDI.
  • RF y Microwaves.

 

CISA PRINTED CIRCUITS

Advanced technology for PCB manufacturing

Printed circuit board manufacturing requires precision, reliability, and top-level technology. That's why our plant uses state-of-the-art machinery and automated processes that guarantee high performance at every stage of production.

Each section is equipped with fully automated chemical lines, allowing us to maintain a constant and predictable workload, ensuring precise planning and timely delivery of each order.

Our systems are designed to handle everything from short runs to large volumes, always meeting the demanding requirements of sectors such as industry, medicine, aerospace, and telecommunications.

Furthermore, preventive maintenance is essential to ensure the perfect condition of our machinery and avoid unexpected downtime.

We continually invest in upgrading our facilities and adopting the latest printed circuit board technology, ensuring the reliability and quality that each customer expects.

Technical specifications in the development stage

Expand the tabs and access all the key information on printed circuit board manufacturing.
General
Base materialsFR4/FR4 HTg/FR2/CEM1/ CEM3/BT-EPOXI/Alta Frecuencia
Electrical continuityMax 10 Ohms
Aspect Ratio1:14
Ionic contaminationMax 1micrEquivgr NaCl/cm2
Impedance controlYes
Fire rating94V-0 (MOT 105º,130º)
FinishesRohs, non-Rohs
Gold edge connectorsYes
Graphite connectorsYes
Kapton/peelable tapeYes
Component marking:Yes
Polymerised drillsYes
SURFACE GEOMETRY (X and Y axes)
Max. dimensions600×600 mm
Width/Space of/between conductors0.10 mm
Min. diameter
Plated drills0.2 mm
Non-plated drills0.3 mm
Buried drills0.2 mm
Microvia0.1 mm
Registration accuracy
External drills/padsmax 0.1 mm
Internal drills/padsmax 0.15 mm
Drill/contourmax 0.1 mm
Pad/soldermaskmax 0.1 mm
Between layersmax 0.1 mm
Drill diameter tolerance
Plated-0.0/+0.1 mm
Non-Plated-0.0/+0.05 mm
Exterior profile tolerance± 0.1 mm
Non-plated space for groovingmin 0.8 mm
Groove position error± 0.10 mm
Photosensitive ink trace widthmin 0.12 mm
Distance between copper pad/photosensitive inkmin 0.12 mm
Legend trace widthmin 0.12 mm
Graphite trace widthmin 0.5 mm
Space between graphitesmin 0.4 mm
Space between graphite/coppermin 0.4 mm
Peelable marginmin 0.4 mm
Space between peelable/nodemin 1.0 mm
Max. diameter peelable mask drills1.8 mm
MICROSECTION (Z axis)
Number of layers1-12
Base material thickness0.5/0.8/1.0/1.2/1.6/2.0/2.4/3.2
Plating thicknesses
Conductors (min Cu)25 μ
Drill (min Cu)25 μ
Buried drills (min CU)15 μ
Overhangmin 15 μ
Grooved bore (tolerance)± 0.1 mm
Bow and twistMax 1%
Chamfer G/F angle20º,30º,45º

Expert technical team ensures quality and precision in every PCB

 

Our technical teamis led by chemical science graduates and with a wealth of experience garnered over years spent studying printed circuit processes, who are ideally placed to provide solutions to any problems relating to the manufacture of PCBs.

The chemical laboratory is equipped with everything necessary for appropriate analysis and testing during each chemical process:

  • High-resolution metallographic microscope with digital image capture.
  • Spectrophotometric equipment for analysing different wavelengths.
  • Atomic absorption equipment for analysing metals in solution.
  • Cyclic voltammetry analysis equipment to control active additives and contaminants in galvanic lines.
  • Infrared lamps and muffles up to 1000 °C for gravimetric analysis.
  • Meters for copper thickness both on the surface and in drill interiors.
  • Gauges for thickness of Ni/Au and silver plating on copper..
  • High-precision digital scales..
  • Systematic use of statistical techniques to determine any anomalies detected in and during the manufacture processes.


Countless other standards and protocols to obtain 100% quality control and assurance during the manufacturing process.

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Innovation, control and precision at every stage of technical development

Engineering Department: Precision from Design to Delivery

Our Engineering Department is comprised of highly qualified professionals who are continuously trained in the latest technologies applied to the design and manufacturing of printed circuit boards. This training allows us to develop products with optimized designs, perfectly tailored to each client's specifications, and with reliable results from the first unit.

Each new project received is subject to a detailed technical protocol that classifies the documentation by type and generates a specific Worksheet. It defines all the steps and quality controls, both general and specific, that will be applied during circuit manufacturing.

We have a team specialized in processes, time, and materials, responsible for optimizing every phase of production. This precise resource management allows us to rigorously plan our workload and meet our agreed-upon delivery deadlines.

To ensure maximum efficiency and control, we have CAD systems for master generation, CNC programming for drilling, integrated databases for optical and electrical testing, and automatic electrolytic lines. All of this is geared toward a single objective: offering printed circuit board manufacturing with the highest quality standards.

 

We approach your project from the phase you need

We have a highly qualified team and a solid track record dating back to 1965, which allows us to offer comprehensive and customized solutions in the printed circuit board (PCB) sector. Our priority is to ensure the success of each project, adapting to technological advances and market demands.

Services

Electronics and PCB Solutions

We transform your idea into a functional printed circuit board, managing every phase of the process with precision: from the initial concept to the final product.

Design

Starting with a simple idea, we create the optimal design for your PCB.
Design Services

  • Design of electronic layouts.
  • Printed circuit board (PCB) design
  • Creating graphical interfaces
  • Systems integration on PCB
  • Software and firmware development
  • Native mobile applications (iOS / Android)

Manufacture

We manufacture all types of PCBs and work with all materials. Manufacturing Services:

  • Production of prototypes and series
  • Urgent and standard lead-time manufacturing
  • Scheduled deliveries
  • Rigid, flexible and Rigid-Flex PCBs
  • Standard and special materials
  • Impedance control
  • Blind and buried drills

Assembly

We have assembly lines for both SMD and THT. PCB Assembly (PCBA):

  • High-speed, high-precision surface mount (SMD)
  • THT Assembly (Through-Hole Technology)
  • Wave soldering
  • Automated Optical Inspection (AOI)
  • Functional verification
  • Supply and integration of displays

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Services

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